| 摘要 |
<P>PROBLEM TO BE SOLVED: To resolve the problem that the height of the circuit module becomes large because an electronic component is mounted on a circuit substrate, an insulation resin covers the electronic component and is formed at a level higher than the electronic component, and an auxiliary substrate is placed on the insulation resin in the circuit module including the auxiliary substrate. <P>SOLUTION: A circuit module is formed so that at least one electronic component, out of the electronic components, is contacted with an auxiliary substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
