发明名称 |
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF |
摘要 |
A semiconductor package includes: a chip having an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; an encapsulant encapsulating the chip and having opposite first and second surfaces, the first surface being flush with the active surface of the chip; and first and second metal layers formed on the second surface of the encapsulant, thereby providing a rigid support to the overall structure to prevent warpage and facilitating heat dissipation of the overall structure.
|
申请公布号 |
US2012161301(A1) |
申请公布日期 |
2012.06.28 |
申请号 |
US201113112226 |
申请日期 |
2011.05.20 |
申请人 |
HUANG JUNG-PANG;HUANG HUI-MIN;CHUANG KUAN-WEI;LIN CHUN-TANG;JIANG YIH-JENN;SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
HUANG JUNG-PANG;HUANG HUI-MIN;CHUANG KUAN-WEI;LIN CHUN-TANG;JIANG YIH-JENN |
分类号 |
H01L23/495;H01L21/60;H01L23/48 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|