发明名称 |
LIGHT EMITTING DIODE CHIP AND METHOD OF FABRICATING THE SAME |
摘要 |
Exemplary embodiments of the present invention provide light emitting diode (LED) chips and a method of fabricating the same. An LED chip according to an exemplary embodiment includes a substrate; a light emitting structure arranged on the substrate, and an alternating lamination bottom structure arranged under the substrate. The alternating lamination bottom structure includes a plurality of dielectric pairs, each of the dielectric pairs including a first material layer having a first refractive index and a second material layer having a second refractive index, the first refractive index being greater than the second refractive index.
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申请公布号 |
US2012161176(A1) |
申请公布日期 |
2012.06.28 |
申请号 |
US201113073522 |
申请日期 |
2011.03.28 |
申请人 |
HEO MIN CHAN;JIN SANG KI;KIM JONG KYU;SHIN JIN CHEOL;LEE SO RA;LEE SUM GEUN;SEOUL OPTO DEVICE CO., LTD. |
发明人 |
HEO MIN CHAN;JIN SANG KI;KIM JONG KYU;SHIN JIN CHEOL;LEE SO RA;LEE SUM GEUN |
分类号 |
H01L33/50 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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