ANISOTROPIC CONDUCTIVE ADHESIVE FILM, CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING SAME

摘要

Provided is an anisotropic conductive adhesive film for anisotropic conductive connection of a terminal of a flexible substrate with a terminal of a rigid substrate, wherein conductive particles are employed having a particle size of at least 4 µm and a compressive hardness of at least 4500 kgf/mm2, such that the pressing-in ratio defined by 100·(A - B)/A, where A is the particle size of the conductive particles after anisotropic conductive connection and B is the gap between the terminal of the flexible substrate and the terminal of the rigid substrate, is at least 40%. Also, the conductive particle sphericity expressed by a/b, where a is the maximum diameter of the conductive particles and b is the minimum diameter thereof, is no more than 5.