| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal release adhesive film produced by using a plant originated lignin as a main raw material and having a thermosetting property. <P>SOLUTION: The thermal release adhesive film is constituted of an adhesive layer composed of a lignin, a curing agent and a base polymer, and a substrate, wherein the adhesive layer is curable with heat. The lignin is preferably obtained by separating a lignin from cellulose components and hemicellulose components by a treating method to use water as exclusive medium and dissolving the separated lignin in an organic solvent. Preferably, the lignin is soluble in organic solvents and the adhesive layer contains 10-90 mass% of the lignin. Preferably, the lignin has a weight average molecular weight of 100-7,000 and the sulfur atom content in the lignin is ≤2 mass%. <P>COPYRIGHT: (C)2012,JPO&INPIT |
