| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC sheet inserting device which determines whether a thermoplastic resin material is melting and spreading out of a gap between pages holding the IC sheet, when the IC sheet covered with a thermoplastic resin material is held between paper pages of a booklet and the paper pages of the booklet overlapping the IC sheet are heated and pressurized to fuse them, and to provide a method for inserting the IC sheet. <P>SOLUTION: The IC sheet inserting device includes a paired-booklet supply unit, a booklet opening unit, an IC sheet supply unit, a page holding plate inserting unit, a thermal pressure bonding unit, a cooling unit, a page holding plate recovering unit, an IC sheet check unit which checks paired IC booklets with an IC sheet bonded to an over message page to see if the quality of adhesiveness of the IC sheet to the over message page is good or not, and an emergency booklet ejecting unit which ejects a booklet determined to be a defective by the IC sheet check unit. <P>COPYRIGHT: (C)2012,JPO&INPIT |
