| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a phenolic resin composition, which shows high elongation even when the composition is applied to a semiconductor device and cured by heat at 250°C or lower, and can be used as an alternative material of a polyimide resin or a polybenzoxazole resin, and to provide a method for producing a cured relief pattern using the composition, and a semiconductor device having the cured relief pattern. <P>SOLUTION: A photosensitive resin composition for a surface protective film of a semiconductor element or an interlayer insulating film contains the following ingredients in a solvent: 100 pts.mass of a phenolic resin (A) having a biphenyl diyl structure in the main chain; 1 to 30 pts.mass of a photoacid generator (B); and 1 to 60 pts.mass of a compound (C) capable of reacting with the ingredient (A) by an acid generated by the photoacid generator (B) or heat. <P>COPYRIGHT: (C)2012,JPO&INPIT |
