发明名称 METHOD FOR INSPECTING SUBSTRATE
摘要 The present invention relates to a method for inspecting a substrate on which an object to be measured is formed, and according to the present invention, comprises the following steps: measuring the substrate on which the object to be measured is formed to create a plane equation for the substrate; finding the area of the object to be measured, which is formed on the substrate; converting the area of the object to be measured into a substrate plane using the plane equation, taking into consideration the height of the object to be measured; and inspecting the object to be measured based on the area of the object to be measured, which is converted into the substrate plane using the plane equation, and the area of the object to be measured according to reference data. As a result, finding the offset value of the object to be measured, from a tilted position of the substrate on which the object to be measured is formed, and using same to compensate for the distortion of measurement data, can enhance the reliability of the measurement of the object to be measured.
申请公布号 WO2012050378(A3) 申请公布日期 2012.06.28
申请号 WO2011KR07630 申请日期 2011.10.13
申请人 KOH YOUNG TECHNOLOGY INC.;LEE, HYUN-KI;KWON, DAL-AN;JEON, JEONG-YUL 发明人 LEE, HYUN-KI;KWON, DAL-AN;JEON, JEONG-YUL
分类号 G01N21/93;G01B11/00 主分类号 G01N21/93
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