HEAT-CURABLE POLYORGANOSILOXANE COMPOSITION AND USE THEREOF

摘要

A heat-curable polyorganosiloxane composition is provided. The heat-curable polyorganosiloxane composition comprises (A) an alkenyl-containing linear polyorganosiloxane represented by formula (I), (B1) a linear polyorganohydrogensiloxane represented by formula (II), (B2) a cyclic polyorganohydrogensiloxane which comprises Re 2HSiO1/2 units (wherein Re represents a hydrogen atom or a C1-6 alkyl) and SiO4/2 units and has, per molecule, three or more hydrogen atoms each bonded to a silicon atom, (C) a platinum-based catalyst, and (D) an adhesion promoter, wherein the ratio of the sum of the number (HB1) of the hydrogen atoms of (B1) and the number (HB2) of the hydrogen atoms of (B2), HB1+HB2, to the number (ViA) of the alkenyl groups of (A) is 0.2-1.0 and the ratio of HB1 to HB1+HB2 is 0.5-0.8.