发明名称 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>A wiring board includes: a semiconductor chip; an insulating layer in which the semiconductor chip is embedded; a wiring connected to the semiconductor chip; and reinforcing layers for reinforcing the insulating layer, the reinforcing layers respectively formed on a front face side of the insulating layer and a rear face side of the insulating layer.</p>
申请公布号 KR101160528(B1) 申请公布日期 2012.06.28
申请号 KR20060045339 申请日期 2006.05.19
申请人 发明人
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
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