DEVICE AND METHOD FOR LED DIE BONDING

摘要

PURPOSE: A light emitting diode die bonding device and a die bonding method are provided to perform a die bonding process at high speed by simultaneously aligning and bonding a lead frame. CONSTITUTION: A lead frame supplying unit transfers a lead frame to a stage supplying position. A lead frame aligning unit(120) receives the lead frame and aligns the lead frame. An epoxy dotting unit(130) dots epoxy on the aligned lead frame. A multi head unit(150) picks up the aligned die and provides the die to a bonding unit by rotating at a preset angle. A bonding unit bonds the die provided from the multi head to the lead frame dotted with epoxy. A lead frame discharging unit(112) absorbs the die-bonded lead frame and unloads the die-bonded lead frame.