| 摘要 |
The present invention relates to an integrated circuit chip package device, which comprises a package base (30) and a planar dielectric substrate (10), having at least on a first surface (11) at least one conductive antenna pattern (15) as well as metallic lines (19, 19'...), which are electrically connected by means of first flip-chip balls (50) to at least one semiconductor die (20) which each comprises at least one radio frequency (RF) chip. The metallic lines (19, 19'...) are further electrically connected by means of further flip-chip balls (51, 51') to at least two contact pads (33, 33') which form a part of the package base (30). This arrangement allows the elimination of wire bonds and thus achieves a higher mechanical stability of the integrated circuit chip package device. Also, a solution for the heat dissipation from the at least one RF chip is achieved. |
