发明名称 |
Composition and manufacturing method |
摘要 |
A device includes a substrate (308) and a metallic layer (336) formed over the substrate (308) with a deposition process for which the metallic layer (336) is characterizable as having a pre-determinable as-deposited defect density. As a result of a fabrication process, the defect density of the metallic layer (336) is reduced relative to the pre-determinable as-deposited defect density of the same layer (336) or another layer having like composition and which is formed under like deposition conditions. In a related method, a substrate (308) is provided and a removable layer (330) is formed over the substrate (308). A metallic layer (336) is formed over the removable layer (330) and is patterned and etched to define a structure over the removable layer (330). The removable layer (330) is removed, and the metallic layer (336) is heated for a time beyond that necessary for bonding of a hermetic sealing cap (340) thereover. |
申请公布号 |
EP2468928(A2) |
申请公布日期 |
2012.06.27 |
申请号 |
EP20110193469 |
申请日期 |
2011.12.14 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
DETOR, ANDREW JOSEPH;CORDERMAN, REED;KEIMEL, CHRISTOPHER;AIMI, MARCO |
分类号 |
C25D3/56;C25D1/00;C25D5/02;C25D5/48;C25D5/50;C25D7/00;C25D7/12;H01H1/00;H01H59/00;H05K13/04 |
主分类号 |
C25D3/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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