发明名称 APPARATUS FOR INDUCTIVELY COUPLED PLASMA PROCESSING
摘要 PURPOSE: A plasma processing apparatus of an inductively coupled type is provided to form a closed loop of an eddy current by forming a plurality of cutting units. CONSTITUTION: A plasma processing apparatus of an inductively coupled type includes a chamber, a susceptor located inside the chamber, and a lead located on the top of the chamber. The lead comprises a lead frame(210) formed into a grid format, a ceramic window(220) installed on the top of the lead frame, and an antenna installed on the top of the window. The lead frame includes an outer frame(211) and an engaging frame(212) extended between outer frames. An RF power supply unit supplies a high frequency of 13.56Mhz to an antenna. A processing gas supply unit supplying a process gas is formed on the lead frame.
申请公布号 KR20120068459(A) 申请公布日期 2012.06.27
申请号 KR20100130093 申请日期 2010.12.17
申请人 LIGADP CO., LTD. 发明人 LEE, SEOUNG WOOK;SON, HYOUNG KYU;LEE, CHANG KEUN
分类号 H05H1/46;H01L21/3065 主分类号 H05H1/46
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