发明名称 DICING DIE BONDING FILM
摘要 <p>PURPOSE: A pressure-sensitive dicing die bonding film is provide to comprise adhesive layers having different adhesion each other to an adhesive layer and a ring frame, thereby having frame stability, and high pick-up success rate. CONSTITUTION: A pressure-sensitive dicing die bonding film comprises a base film(4), a tackifying layer(5) formed on the base film, and an adhesive layer formed on the top of the adhesive layer. The adhesive force between the tackifying layer and the ring frame(B) is B/A>=1.1. The slid distance of the tackifying layer is 0-0.1 mm, when applying force to the tackifying layer by 10 gf per unit area 1mm^2. The tackifying layer is a monolayer, the thickness of the tackifying layer is 3-40 micron, and the tackifying layer comprises silane coupling agent.</p>
申请公布号 KR20120068453(A) 申请公布日期 2012.06.27
申请号 KR20100130084 申请日期 2010.12.17
申请人 CHEIL INDUSTRIES INC. 发明人 UH, DONG SEON;KIM, JI HO;HWANG, MIN KYU;CHO, KYUN GRAE;SONG, KI TAE
分类号 C09J7/02;C09J9/00;C09J133/04;H01L21/58 主分类号 C09J7/02
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