| 摘要 |
PURPOSE: A semiconductor package is provided to improve the property and reliability of a semiconductor package by preventing a copper element on a substrate from moving to a semiconductor chip. CONSTITUTION: Circuit wiring(120) has a bond finger(122) while being formed on one side of a body. An insulating layer is formed in order to expose the bond finger onto the circuit wiring. The insulating layer includes first and second insulating layer patterns(124, 126). A diffusion prevention part(130) is formed on a pattern portion of the first insulating layer in order not to cover the bond finger. The semiconductor chip is mounted on one side of the substrate while being electrically connected to the bond finger.
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