| 摘要 |
PROBLEM TO BE SOLVED: To provide a device that can peel a sheet for sure without generating poor peeling when an adhesive sheet attached to an adherend is peeled off, and to provide a method of peeling. SOLUTION: A sheet peeling device 10 includes a support means 11 for supporting a semiconductor waver W to which an adhesive sheet S is attached, a sheet adhesion means 12 for attaching a peeling sheet PS on the adhesive sheet S, a holding means 13 for holding a part to be held, a PS1 of the peeling sheet PS, a moving means 14 for turnably supporting the holding means 13 by setting an axis of rotation P at a predetermined position, and a pulling means 16 for pulling the peeling sheet PS in an outward direction. The pulling means 16 starts performing peeling at a small angle where a peeling angleθis close to 0 degree as much as possible, by giving a peeling force Fr to the peeling sheet PS outward along the surface of the wafer W, when a peeling of the adhesive sheet S starts. COPYRIGHT: (C)2009,JPO&INPIT |
