ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED GROUND OR POWER DISTRIBUTION

摘要

PURPOSE: A stacked microelectronic assembly including a central contact is provided to reduce inductance of a bond wire connector by providing an additional current path between connected contacts. CONSTITUTION: An electrically conductive plane is connected to one or more contacts of a first micro electronic element(12) or a second micro electronic element(14). A first passive device is arranged between a protrusion of the front side of the second micro electronic element and a first surface of a dielectric element. A second passive device is exposed to a second surface of the dielectric device between two openings. A lead(50) is extended from the first passive device to one element of the micro electronic element. A plurality of terminals exposed to the second surface of the dielectric element is electrically connected to a circuit panel.