METHOD FOR ETCHING OF SILICON SURFACES

摘要

The invention relates to a method for etching of silicon surfaces with the following steps: Furnishing an aqueous alkaline hydrocolloid etching solution containing at least one hydrocolloid, at a temperature of 50° C. to 95° C., bringing the silicon surface in contact with the hydrocolloid etching solution for a specified duration, and Removing the hydrocolloid etching solution from the silicon surface.