| 摘要 |
PURPOSE: A semiconductor chip and a semiconductor package including the same are provided to reduce manufacturing costs by omitting an under-fill process which is performed to compensate for mounting reliability. CONSTITUTION: A semiconductor chip body(102) has one side on which a plurality of bonding pads is arranged and the other side facing the one side. A circuit pattern(104) is formed inside the semiconductor chip body and includes an amplification and inverting circuit. An interval maintenance device maintains a certain interval with the semiconductor chip body while being electrically connected with the circuit pattern. A sensing device(A) measures an interval with the semiconductor chip body. A compensation device(B) compensates for the interval with the semiconductor chip body. |
