发明名称 Method and system for processing plate material, and various devices concerning the system
摘要 <p>An actual plate thickness and actual material constants are measured during punching before bending. The measured information is reflected on the bending, so that the bending is performed efficiently and accurately. Punching is carried out for each blank developed based on a nominal plate thickness and nominal material constants in blanking before the bending of a work W. Then, an actual plate thickness distribution and an actual material constant distribution of the work W are calculated based on various data containing a ram stroke and a pressure detected in the punching. &lt;IMAGE&gt;</p>
申请公布号 EP1925375(A3) 申请公布日期 2012.06.27
申请号 EP20080004408 申请日期 2001.01.16
申请人 AMADA COMPANY, LTD. 发明人 KOYAMA, JUNICHI;OMATA, HITOSHI;HAYAMA, OSAMU;IMAI, KAZUNARI;TAKEHARA, TOKURO;ANZAI, TETSUYA
分类号 B21D5/02;B21D28/12;B21D28/24 主分类号 B21D5/02
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