| 摘要 |
PROBLEM TO BE SOLVED: To surely and appropriately diffuse heat from a power device that is mounted on a printed board. SOLUTION: A power transistor 110 is arranged in an opening 121 of a circuit board 120 to be mounted, and a first heat slinger 130 wherein the power transistor 110 is screwed by a screwing member 151 in freely attachable/detachable manner is arranged under the circuit board 120. A second heat slinger 140 arranged between the first heat slinger 130 and the circuit board 120 is provided on the upper surface of the first heat slinger 130 while the power transistor 110 is inserted into a square hole 142 as a communicating hole. The thermal expansion coefficient of the second heat slinger 140 is approximate to that of the circuit board 120 than the first heat slinger 130. COPYRIGHT: (C)2008,JPO&INPIT |
