发明名称 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>A printed wiring board has a first substrate (10) with multiple wiring layers, and a second substrate (20) with wiring layers whose conductor density is set higher than that of the first substrate (10). The first substrate (10) and the second substrate (20) are electrically connected through each wiring layer, and the second substrate (20) is embedded in an accommodation section (100a).</p>
申请公布号 EP2280594(A4) 申请公布日期 2012.06.27
申请号 EP20080874395 申请日期 2008.12.22
申请人 IBIDEN CO., LTD. 发明人 TAKAHASHI, MICHIMASA
分类号 H05K3/46 主分类号 H05K3/46
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