发明名称 APPARATUS FOR INDUCTIVELY COUPLED PLASMA PROCESSING
摘要 PURPOSE: A plasma processing apparatus of a inductively coupled type is provided to form a closed loop of an eddy current by forming a plurality of cutting units in a lead frame. CONSTITUTION: A lead comprises a lead frame formed into a grid format, a window(220) installed on the top of the lead frame, and an antenna installed on the top of the window. An RF power supply unit provides high frequency to the antenna. The lead frame comprises an outer individual frame unit(211) and an inner individual frame unit(212) locating inside the outer individual frame unit. Four link frame units(213) connect the inner individual frame unit with the outer individual frame unit. One or more cutting units(214) are formed in a straight frame of the inner individual frame unit, respectively. A first O-ring(240) seals hermetically the entire outside of the lead frame. Engineering plastic(250) is installed on the top of the first O-ring.
申请公布号 KR20120067521(A) 申请公布日期 2012.06.26
申请号 KR20100128958 申请日期 2010.12.16
申请人 LIGADP CO., LTD. 发明人 LEE, SEOUNG WOOK;SON, HYOUNG KYU;LEE, CHANG KEUN
分类号 H05H1/30 主分类号 H05H1/30
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