| 摘要 |
PURPOSE: A multilayer wiring substrate and a manufacturing method thereof are provided to improve connection reliability of a via conductor by restricting a stripping process on the via conductor. CONSTITUTION: A via hole(51) is formed inside an interlayer dielectric resin layer(33) which separates a lower conductive layer(41) from an upper conductive layer(42). A via conductor(52) is formed inside the via hole in order to connect the upper conductive layer and the lower conductive layer. The surface of the interlayer dielectric resin layer is formed into a rough surface. The via hole is opened on the rough surface of the interlayer dielectric resin layer. A stepped part(53) is formed within a boundary region of an opening part near the via hole in order to be dented from an edge region near the boundary region. The stepped part has surface roughness higher than the boundary region. |
