发明名称 Laser diode package with enhanced cooling
摘要 A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.
申请公布号 US8208508(B2) 申请公布日期 2012.06.26
申请号 US201113198384 申请日期 2011.08.04
申请人 DERI ROBERT J.;KOTOVSKY JACK;SPADACCINI CHRISTOPHER M.;LAWRENCE LIVERMORE NATIONAL SECURITY, LLC 发明人 DERI ROBERT J.;KOTOVSKY JACK;SPADACCINI CHRISTOPHER M.
分类号 H01S3/04 主分类号 H01S3/04
代理机构 代理人
主权项
地址