发明名称 Method of manufacturing head gimbal assembly
摘要 In a manufacturing method for a head gimbal assembly, before mounting a slider on a suspension, coating films each made of solder are formed on respective terminals of a plurality of leads to be connected to a plurality of electrode pads of the slider. After mounting the slider on the suspension, the coating films are heated with laser light to thereby melt the solder, with the respective terminals of the plurality of leads in contact with the corresponding electrode pads via the respective coating films, whereby the terminals are electrically and physically connected to the electrode pads.
申请公布号 US8205323(B2) 申请公布日期 2012.06.26
申请号 US20090654511 申请日期 2009.12.22
申请人 IWAMA HITOSHI;TDK CORPORATION 发明人 IWAMA HITOSHI
分类号 G11B5/127;H04R31/00 主分类号 G11B5/127
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