发明名称 |
Electrical connections for multichip modules |
摘要 |
Conductive lines are formed on a wafer containing multiple circuits. The conductive lines are isolated from the circuits formed within the wafer. Chips are mounted on the wafer and have their chip pads connected to the conductive lines of the wafer. The wafer may then be protected with a packaging resin and singulated.
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申请公布号 |
US8207617(B2) |
申请公布日期 |
2012.06.26 |
申请号 |
US201113154296 |
申请日期 |
2011.06.06 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YOUN SUNPIL;LEE SEOK-CHAN |
分类号 |
H01L29/40 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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