发明名称 Constant and reducible hole bottom CD in variable post-CMP thickness and after-development-inspection CD
摘要 A new method is provided for the creation of a hole through a layer of insulating material. The method provides for combining a feed-forward method with a feed backward method and a high-polymer based hole profile, in order to establish a hole of a constant Critical Dimension for the hole bottom, making the CD of the hole bottom independent of the CD of the opening created through the overlying developed layer of photoresist and independent of the thickness of the layer of insulator material after CMP has been applied to the surface of the insulation layer.
申请公布号 US8207532(B2) 申请公布日期 2012.06.26
申请号 US20030661793 申请日期 2003.09.12
申请人 KAO CHI-AN;CHANG YUNG-CHANG;CHANG YU-PING;WANG LING-SUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY 发明人 KAO CHI-AN;CHANG YUNG-CHANG;CHANG YU-PING;WANG LING-SUNG
分类号 H01L23/58;H01L21/311;H01L21/66;H01L21/768 主分类号 H01L23/58
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