| 摘要 |
PURPOSE: A light emitting device package is provided to decentralize external shocks by forming an upper side of a molding member made out of a silicon resin into a curved surface. CONSTITUTION: A first lead frame(11) and a second lead frame(12) are arranged to be contiguous each other. A molding member(20) is formed on the first lead frame and the second lead frame and have a cavity(C) limiting a light emitting region. The molding member can be formed in a gap portion(G) between the first lead frame and the second lead frame. A light emitting device chip(30) is connected to the first lead frame and the second lead frame in the cavity. An encapsulating material(40) protects the light emitting device chip within the cavity.
|
