发明名称 |
VACUUM PROCESSING APPARATUS |
摘要 |
PURPOSE: A vacuum processing apparatus is provided to uniformly distribute plasma in a vacuum chamber by locally laminating a high permittivity dielectric film on a seating area of a high frequency antenna from whole area of a dielectric window. CONSTITUTION: A vacuum chamber(110) includes a processing space performing various kinds of processes including etching or deposition of a substrate(10). A dielectric window(120) is arranged on an upper opening of the vacuum chamber. The dielectric window transfers high frequency power to the inside of the vacuum chamber with a high frequency antenna(130) while vacuum or decompression of the vacuum chamber is maintained. The high frequency antenna is arranged on the top of the dielectric window. A high permittivity dielectric film(140) is locally laminated on a seating area of the high frequency antenna in the dielectric window in order to uniformly generate plasma inside the vacuum chamber. |
申请公布号 |
KR20120066990(A) |
申请公布日期 |
2012.06.25 |
申请号 |
KR20100128370 |
申请日期 |
2010.12.15 |
申请人 |
WONIK IPS CO., LTD. |
发明人 |
KIM, DONG SOO;CHO, SAENG HYUN |
分类号 |
H05H1/46;H01L21/205;H01L21/3065 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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