发明名称 PRINTED CIRCUIT BOARD INCLUDING AT LEAST ONE LAYER
摘要 <p>PURPOSE: A PCB(Printed Circuit Board) which includes one or more layers is provided to improve yield by reducing the whole thickness. CONSTITUTION: A second layer(200) is arranged at the upper side of a first layer. The first layer comprises a first signal line, a first ground line, and a second ground line. The first signal line transfers a signal. The first ground line and the second ground line are formed at both sides of the first signal line while having a first interval. The second signal line transfers the signal. The second layer comprises a second signal line, a third ground line, and a fourth ground line. The third ground line and the fourth ground line are formed at both sides of the second signal line while having the first interval.</p>
申请公布号 KR20120067057(A) 申请公布日期 2012.06.25
申请号 KR20100128465 申请日期 2010.12.15
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SONG, KI JAE;PARK, WOO IK
分类号 H05K3/46;H03H7/40 主分类号 H05K3/46
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