POLYAMIDE RESIN COMPOSITION HAVING GOOD REFLECTANCE, HEAT RESISTANCE, AND HUMIDITY RESISTANCE

摘要

PURPOSE: A polyamide resin composition is provided to have excellent heat resistance and moisture resistance without degrading reflectivity and physical properties. CONSTITUTION: A polyamide resin composition 100.0 parts by weight of polyamide resin, 0.1-50 parts by weight of white pigment, and 0.01-20 parts by weight of sodium phosphate. The polyamide resin comprises aromatic dicarboxylic acid and an aliphatic group or cycloaliphatic diamine as repeating units. The polyamide resin is in chemical formula 3, has melting point of 200°C or higher. In chemical formula 3, m is 4-12, and n is an integer from 50-500. The resin composition additionally comprises 0.01-80 parts by weight of filler.