| 摘要 |
PURPOSE: A method for washing a semiconductor wafer consisting of silicon just after a polishing process of the semiconductor wafer is provided to effectively and rapidly wash the polished front side and rear side of the semiconductor wafer. CONSTITUTION: A semiconductor wafer is transferred from a polishing plate to a first cleaning module. The semiconductor wafer is washed between rollers rotated by water. An aqueous solution containing a hydrogen fluoride and a surfactant is sprayed to the side of the semiconductor wafer. The water is sprayed to the side of the semiconductor wafer. The semiconductor wafer is dipped into a water-soluble alkaline cleaning solution. The semiconductor wafer is washed between the rollers rotated by the water. The water is sprayed to the semiconductor wafer. The semiconductor wafer is dried. |
