发明名称 ETCHANT AND THE ETCHING METHOD USING THE SAME
摘要 PURPOSE: Etchant and an etching method using the same are provided to selectively etch a copper layer in an object comprising an oxide layer and the copper layer. CONSTITUTION: Etchant is used for etching an object comprising a copper layer and a metal oxide layer including metal oxide of one or more selected from Zn, Sn, Al, In, and Ga. The etchant is a solution which comprises 0.1-3.0 weight% of copper ion as a second copper ion source, 0.1-30.0 weight% of organic acid with a carbon number of 6 weight% or less, and 0.1-3.0 weight% of one or more nitrogen-containing compounds selected from the group consisting of heterocyclic compounds having two or more nitrogen atoms in a loop and amino-containing compounds. The Ph of the solution is 5.0-10.5.
申请公布号 KR20120066581(A) 申请公布日期 2012.06.22
申请号 KR20110118604 申请日期 2011.11.15
申请人 MEC COMPANY LTD. 发明人 ISHIDA TERUKAZU;DEGUCHI YUKARI;SATO MINA
分类号 C23F1/10;C23F1/02 主分类号 C23F1/10
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