| 摘要 |
PURPOSE: A light emitting diode package is provided to prevent short due to excessive lead and non-solder due to lead shortage by receiving a part of soldering in a soldering receiver of a lead frame. CONSTITUTION: A pair of lead frames(20) are electrically connected to a light emitting diode chip. A lead frame includes a soldering receiver(21). The soldering receiver includes a groove unit which opens both ends thereof in a transverse direction of the lead frame. A package body(10) surrounds the light emitting diode chip and the lead frame. The package body includes a lens which is formed by a transfer molding.
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