发明名称 |
METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE |
摘要 |
<p>A first impurity region (123) is formed by ion implantation through a first opening formed in a mask layer (31). By depositing a spacer layer (32) on an etching stop layer on which the mask layer (31) has been provided, a mask portion (30) having the mask layer (31) and the spacer layer (32) is formed. By anisotropically etching the spacer layer (32), a second opening (P2) surrounded by a second sidewall is formed in the mask portion (30). A second impurity region (124) is formed by ion implantation through the second opening (P2). An angle (AW) of the second sidewall with respect to a surface (SO) is 90°~10° across a height (HT) as great as a second depth (D2). Thus, accuracy in extension of an impurity region can be enhanced.</p> |
申请公布号 |
CA2780359(A1) |
申请公布日期 |
2012.06.22 |
申请号 |
CA20112780359 |
申请日期 |
2011.08.09 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
OOI, NAOKI;SHIOMI, HIROMU |
分类号 |
H01L21/266 |
主分类号 |
H01L21/266 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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