发明名称 INSULATING LAYER POLISHING SLURRY COMPOSITION AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
摘要 PURPOSE: An insulation layer polishing slurry composition and a method for manufacturing a semiconductor device using the same are provided to polish an insulation layer without damaging a metal pattern by including metal passivation agents with an amine group in the insulation layer polishing slurry composition. CONSTITUTION: A bottom insulating layer(20) is formed on a substrate(10). A contact plug(25) electrically connected to a transistor is formed in the bottom insulation layer. A bottom electrode(31) is formed on the contact plug and the bottom insulation layer. A magnetic tunnel junction structure is formed on the bottom electrode. The magnetic tunnel junction structure includes a ferromagnetic pinned layer(33), a tunnel barrier layer(35), and a free layer(37).
申请公布号 KR20120066515(A) 申请公布日期 2012.06.22
申请号 KR20100127889 申请日期 2010.12.14
申请人 IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) 发明人 PARK, JEA GUN;PARK, JIN HYUNG;LIM, JAE HYUNG;CHO, JONG YOUNG;CUI HAO;HWANG, HEE SUB
分类号 H01L21/304;C09K3/14;G11C11/15 主分类号 H01L21/304
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