发明名称 |
INSULATING LAYER POLISHING SLURRY COMPOSITION AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
PURPOSE: An insulation layer polishing slurry composition and a method for manufacturing a semiconductor device using the same are provided to polish an insulation layer without damaging a metal pattern by including metal passivation agents with an amine group in the insulation layer polishing slurry composition. CONSTITUTION: A bottom insulating layer(20) is formed on a substrate(10). A contact plug(25) electrically connected to a transistor is formed in the bottom insulation layer. A bottom electrode(31) is formed on the contact plug and the bottom insulation layer. A magnetic tunnel junction structure is formed on the bottom electrode. The magnetic tunnel junction structure includes a ferromagnetic pinned layer(33), a tunnel barrier layer(35), and a free layer(37).
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申请公布号 |
KR20120066515(A) |
申请公布日期 |
2012.06.22 |
申请号 |
KR20100127889 |
申请日期 |
2010.12.14 |
申请人 |
IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
发明人 |
PARK, JEA GUN;PARK, JIN HYUNG;LIM, JAE HYUNG;CHO, JONG YOUNG;CUI HAO;HWANG, HEE SUB |
分类号 |
H01L21/304;C09K3/14;G11C11/15 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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