发明名称 FILM FORMING APPARATUS FOR SEMICONDUCTOR PROCESS AND METHOD FOR USING THE SAME, AND COMPUTER READABLE MEDIUM
摘要 PURPOSE: A film forming apparatus for processing a semiconductor, and a method for using the same, and a computer readable medium are provided to easily deal with the narrowness of a scattering amount tolerance range by controlling the scattering of metal components within a treatment container. CONSTITUTION: A manifold(3) supports a bottom portion of a treatment container(1). A wafer boat(5) is loaded on a table(8) by interposing a heat insulating tube(7) made of quartz. A magnetic fluid seal(11) is installed in a through part of a rotary shaft(10). A seal member(12) is interposed between a peripheral portion of a cover part(9) and a bottom portion of the manifold. A fuzzy gas supply tool(16a) includes a fuzzy gas supply source(25a) and a nozzle.
申请公布号 KR20120066617(A) 申请公布日期 2012.06.22
申请号 KR20120057537 申请日期 2012.05.30
申请人 TOKYO ELECTRON LIMITED 发明人 OKADA MITSUHIRO;TONEGAWA YAMATO
分类号 H01L21/205 主分类号 H01L21/205
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