LIGHT EMITTING DIODE PACKAGE

摘要

PURPOSE: A light emitting diode package is provided to improve light extraction efficiency on a surface of a chip by forming a lens to cover the light emitting diode chip. CONSTITUTION: A package body(11) includes a first electrode structure(12a) and a second electrode structure(12b). A light emitting diode chip(15) is mounted on the package body. A first lens unit(18a) is made of molding resins with a first refractive index. A second lens unit(18b) is made of molding resins with a second refractive index which is different from the first refractive index. The first lens unit and the second lens unit are formed by compression molding process.