发明名称 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSED BY THIS METHOD
摘要 <p>[Object] To provide a substrate processing method capable of forming a concavo-convex structure on a substrate surface while reducing the number of processes. [Solving Means] In a substrate processing method according to the present invention, particles (11) are dispersed on a surface (10s) of a substrate (10), and a concavo-convex structure (12) is formed on the surface of the substrate by etching the surface of the substrate with the particles as a mask and the mask (11) is simultaneously removed by the etching. According to this method, a process of removing the mask (11) from the substrate surface (10s) after the concavo-convex structure (12) is formed becomes unnecessary. Accordingly, since the number of processes necessary to form the concavo-convex structure on the substrate surface is largely reduced, it becomes possible to greatly improve productivity.</p>
申请公布号 KR101159438(B1) 申请公布日期 2012.06.22
申请号 KR20107011380 申请日期 2008.11.13
申请人 发明人
分类号 H01L21/32;H01L21/306;H01L33/24 主分类号 H01L21/32
代理机构 代理人
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