| 摘要 |
PURPOSE: A heat sink is provided to sufficiently secure a design space of a circuit pattern on a printed circuit board by mounting a semiconductor chip in an incline surface integrated with a plurality of heat radiation plates. CONSTITUTION: A plurality of heat radiation plates(10) includes a first heat radiation plate(11), a second heat radiation plate(12), and a third heat radiation plate(13). The third heat radiation plate is received in a step formed in a solder pin. An incline surface is integrated with the plurality of heat radiation plates and includes one or more coupling holes and a semiconductor chip. A lead of the semiconductor chip passes through the printed circuit board by a plurality of lead holes.
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