DIELECTRIC LAYER OF PRINTED CIRCUIT BOARD, METHOD FOR PREPARING THE SAME, AND PRINTED CIRCUIT BOARD COMPRISING THE SAME

摘要

PURPOSE: An insulating layer of a printed circuit board, a manufacturing method thereof, and a printed circuit board including thereof are provided to enhance intensity and lower coefficient of thermal expansion(CTE) by impregnating a single fiber into a material which has a fabric form. CONSTITUTION: An insulating layer of a printed circuit board, a manufacturing method thereof, and a printed circuit board including thereof comprises an insulating polymer resin(200), a material(230) having fabric form, and a single fiber(210). The insulating polymer resin is one or more which is selected from a group consisting of a thermosetting resin, a thermoplastic resin, and a mixture thereof. The insulating polymer resin is used in a fused state. The single fiber has a length between 0.5-5 mm. The single fiber is one or more which is selected from a group consisting of a glass fiber and an aramid fiber.