发明名称 |
METHOD FOR MANUFACTURING SOLDER POWDER AND SOLDER POWDER OBTAINED BY THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing solder powder, capable of simply and efficiently manufacturing fine solder powder allowing an average particle diameter to be controlled within 1-5 μm that is capable of dealing with fine pitching, and also to provide the solder powder obtained by the same. <P>SOLUTION: In the method for manufacturing the solder powder where a tin ion-containing aqueous solution and a reducing agent aqueous solution are mixed and the powder is reduced and precipitated in the mixture solution, when the powder is reduced and precipitated, one or more metal fine powders comprised of elements constituting the powder in the mixture solution are added. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012115860(A) |
申请公布日期 |
2012.06.21 |
申请号 |
JP20100266287 |
申请日期 |
2010.11.30 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
KAWAMURA YOSUKE;MURAOKA HIROKI;NAKAGAWA SUSUMU;HISAYOSHI KANJI |
分类号 |
B23K35/40;B22F1/00;B22F9/24;B23K35/26;C22C13/00 |
主分类号 |
B23K35/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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