发明名称 METHOD FOR MANUFACTURING SOLDER POWDER AND SOLDER POWDER OBTAINED BY THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing solder powder, capable of simply and efficiently manufacturing fine solder powder allowing an average particle diameter to be controlled within 1-5 &mu;m that is capable of dealing with fine pitching, and also to provide the solder powder obtained by the same. <P>SOLUTION: In the method for manufacturing the solder powder where a tin ion-containing aqueous solution and a reducing agent aqueous solution are mixed and the powder is reduced and precipitated in the mixture solution, when the powder is reduced and precipitated, one or more metal fine powders comprised of elements constituting the powder in the mixture solution are added. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012115860(A) 申请公布日期 2012.06.21
申请号 JP20100266287 申请日期 2010.11.30
申请人 MITSUBISHI MATERIALS CORP 发明人 KAWAMURA YOSUKE;MURAOKA HIROKI;NAKAGAWA SUSUMU;HISAYOSHI KANJI
分类号 B23K35/40;B22F1/00;B22F9/24;B23K35/26;C22C13/00 主分类号 B23K35/40
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