发明名称 LASER MACHINING DEVICE AND LASER MACHINING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser machining device and a laser machining method for machining a workpiece by irradiating the workpiece with a laser beam, wherein laser machining can take place with high quality. <P>SOLUTION: There are provided a laser light source configured to emit laser pulses with which a workpiece is irradiated, an irradiation position moving device configured to move an irradiation position on the workpiece at which the laser pulses emitted from the laser light source are irradiated, and a control device configured to control emission of laser pulses from the laser light source so that the laser pulses are emitted with a pulse width and at a frequency in accordance with the time required for the irradiation position moving device to move the irradiation position of laser pulses from one irradiation position on the workpiece to the next irradiation position. The control device controls the emission of laser pulses from the laser light source so that the workpiece is irradiated with laser pulses having a pulse width in a predetermined range. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012115883(A) 申请公布日期 2012.06.21
申请号 JP20100269006 申请日期 2010.12.02
申请人 SUMITOMO HEAVY IND LTD 发明人 OKAMOTO YUJI
分类号 B23K26/00;B23K26/08;H01S3/00 主分类号 B23K26/00
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