发明名称 THERMALLY CONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE MADE OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermally conductive resin composition excellent in flexibility, impact resistance and the like as well as in heat resistance and resistance to moist heat. <P>SOLUTION: The thermally conductive resin composition includes copolymerized polyester resin A and thermally conductive filler B. The capacity ratio A/B between A and B ranges from 30/70 to 90/10, and A contains aromatic dicarboxylic acid and dimer acid as acid components and contains 1,4-butanediols and polybutadiene glycols as glycol components. The content of the dimer acid in the acid components ranges from 10 to 50 mol%, the content of 1,4-butanediols in the glycol components is not less than 80 mol%, and the content of polybutadiene glycols in the glycol components ranges from 1 to 20 mol%. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012117044(A) 申请公布日期 2012.06.21
申请号 JP20110232358 申请日期 2011.10.24
申请人 UNITIKA LTD;NIPPON ESTER CO LTD 发明人 ITO AKIRA;MASAI YUYA;FURUKAWA MIKIO;TOMIZAWA MOTOTAKA;OKOCHI TAKAO
分类号 C08L67/02;C08K3/00 主分类号 C08L67/02
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