| 摘要 |
The invention relates to the cooling of an electronic device including an electronic compartment and consisting of a housing, and at least one electronic board assembled in the housing. The board (11) is to be removably assembled in the housing (10) by means of the translation thereof along a groove (13, 13a) in order to reach an operative position, wherein the assembly of the board (11) is carried out via an insertion surface (17) of the housing (10). According to the invention, the device includes an elongate heat sink (20) arranged along the groove (13, 13a) for collecting the heat emitted by the components (12), and a means (25, 30) for extracting the heat collected by the heat sink (20), the extraction means (25, 30) being located outside the electronic compartment, either at the insertion surface (17) or at a rear surface (18) opposite the insertion surface (17). |
