CHEMICAL MECHANICAL PLANARIZATION (CMP) PAD CONDITIONER AND METHOD OF MAKING
摘要
A method of forming a chemical mechanical planarization (CMP) pad conditioner includes placing abrasive grains on a major surface of a substrate, forming a binding composition at an exterior surface of the abrasive grains, and depositing a bonding layer over the surface of the substrate and a portion of the abrasive grains to secure the abrasive grains to the major surface of the substrate.
申请公布号
WO2012082702(A2)
申请公布日期
2012.06.21
申请号
WO2011US64565
申请日期
2011.12.13
申请人
SAINT-GOBAIN ABRASIFS;SAINT-GOBAIN ABRASIVES, INC.
发明人
WU, JIANHUI;SCHULZ, ERIC, M.;RAMANATH, SRINIVASAN;KHAUND, ARUP, K.