| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a load lock device capable of efficiently cooling a substrate to increase throughput of substrate processing. <P>SOLUTION: A load lock device comprises: a vessel 31 provided so as to be variable in pressure in a range between pressure corresponding to that of a vacuum chamber 5 and atmospheric pressure; a purge gas supplying mechanism 48 for supplying a purge gas into the vessel 31; an exhaust mechanism 44 for exhausting the inside of the vessel 31; a pressure adjustment mechanism 49 for adjusting pressure inside the vessel 31 to pressure corresponding to that of the vacuum chamber 5 when the inside of the vessel 31 is communicated with the vacuum chamber 5, and adjusting the pressure inside the vessel 31 to the atmospheric pressure when the inside of the vessel 31 is communicated with a space having the atmosphere; a cooling member 32 provided in the vessel 31, for cooling a substrate adjacently disposed or placed thereon; and a heat absorbing layer 61 provided at a position opposing to the substrate adjacently disposed or placed on the cooling member 32, for absorbing radiation heat from the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
