发明名称 SUBSTRATE PROCESSING EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide substrate processing equipment capable of obtaining uniform quality of substrates to be treated by preventing electrodes from shrinking and particles from being generated. <P>SOLUTION: Substrate processing equipment comprises: a processing chamber for storing a plurality of substrates being stacked; a heating unit provided around an outer periphery of the processing chamber, for heating a height region of the stacked substrates; a gas supply unit for supplying a treatment gas to the processing chamber; a gas exhaust unit for exhausting an atmosphere in the processing chamber; at least a pair of electrodes to which high-frequency power is applied for activating the treatment gas; and storage tubes each for storing each of the pair of electrodes in a state where at least one portion of the electrode is curved. The electrodes each comprise: a core wire made of metal; a plurality of first tube bodies connected with each other by the core wire in a bendable manner, and provided at a position corresponding to the height region of the stacked substrates; and a plurality of second tube bodies made of quartz, connected with each other by the core wire in a bendable manner, and provided at a position lower than the height region of the stacked substrates. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012119500(A) 申请公布日期 2012.06.21
申请号 JP20100268070 申请日期 2010.12.01
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 ASAI MASAYUKI;KONYA TADASHI
分类号 H01L21/31;C23C16/505;H05H1/46 主分类号 H01L21/31
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